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modularflow | design office for Atomic Layer Deposition
modularflow is a design office for ALD solutions (Atomic Layer Deposition), copper & silver precursors, evaporator and coating systems for research purposes and flow optimization.

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flow modularflow modularflow design office Atomic Layer Deposition copper silver

Die IP-Adresse lautet 80.237.132.243.

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Server-Ping

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4 packets transmitted, 4 received, 0% packet loss, time 601ms
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Die Verbinungszeit zum Server beträgt 9.04ms.

HTTP-Header

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http_versionHTTP/1.1
statuscode200
dateMon, 22 Sep 2014 03:57:21 GMT
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last-modifiedThu, 17 Apr 2014 11:47:07 GMT
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Meta Tags

Meta-TagWert
descriptionmodularflow is a design office for ALD solutions (Atomic Layer Deposition), copper & silver precurso...
keywordsAtomic-Layer-Deposition, ALD, Chemical-Vapor-Deposition, CVD, copper, silver, precursor, Kupferprecu...
robotsall
copyright
authorOliver Feddersen-Clausen, www.modularflow.com
distributionglobal
ratingGeneral
revisit-after14
DC.Descriptionmodularflow is a design office for ALD solutions (Atomic Layer Deposition), copper & silver precurso...
DC.CreatorOliver Feddersen-Clausen, www.modularflow.com
Content-Typetext/html; charset=utf-8
content-languagede
Reply-to[email protected]

Externe Links

AnchorURL
>> myplas.dehttp://www.myplas.de
floss designhttp://www.floss-design.com
Letzte Aktualisierung: 22.09.2014 5:33